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ILX503A 2048-pixel CCD Linear Image Sensor (B/W) For the availability of this product, please contact the sales office. Description The ILX503A is a reduction type CCD linear sensor designed for facsimile, image scanner and OCR use. This sensor reads B4 size documents at a density of 200 DPI (Dot Per Inch). A built-in timing generator and clock-drivers ensure direct drive at 5V logic for easy use. Features * Number of effective pixels: 2048 pixels * Pixel size: 14m x 14m (14m pitch) * Built-in timing generator and clock-drivers * Ultra low lag * Maximum clock frequency: 5MHz Absolute Maximum Ratings * Supply voltage VDD1 VDD2 * Operating temperature * Storage temperature Pin Configuration (Top View) 22 pin DIP (Plastic) 11 6 -10 to +55 -30 to +80 V V C C VOUT GND GND SHSW CLK VDD1 GND VDD2 T1 1 2 3 4 5 6 7 8 9 1 22 VDD2 21 EXRS 20 VDD1 19 RSSW 18 VGG 17 GND 16 GND 15 VDD1 14 NC 13 NC NC 10 ROG 11 2048 12 GND Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E92Y21E78-PS Block Diagram VDD1 NC GND VDD1 VDD2 GND NC 22 20 17 16 15 14 13 12 S1 S2 D34 D35 GND D15 D14 D33 VOUT CCD analog shift register 1 Read out gate Output amplifier Sample-and-hold circuit VGG 18 Clock-drivers Clock pulse generator Sample-and-hold pulse generator Mode selector S2047 S2048 D36 D37 Read out gate pulse generator 2 7 3 6 8 9 5 19 21 4 D38 11 D39 10 T1 VDD1 GND GND GND VDD2 CLK EXRS RSSW SHSW ROG NC -2- ILX503A ILX503A Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 Symbol VOUT GND GND SHSW CLK VDD1 GND VDD2 T1 NC ROG GND NC NC VDD1 GND GND VGG RSSW VDD1 EXRS VDD2 9V power supply GND GND Output circuit gate bias RS pulse external, internal selection (External RS VDD2, Internal RS GND) 9V power supply RS input pin during external RS pulse usage 5V power supply Clock pulse GND Signal output GND GND Switch Description { with S/H GND without S/H VDD2 Clock pulse 9V power supply GND 5V power supply Test pin (VDD2) -3- ILX503A Recommended Voltage Item VDD1 VDD2 Min. 8.5 4.75 Typ. 9.0 5.0 Max. 9.5 5.25 Unit V V Note) Rules for raising and lowering power supply voltage To raise power supply voltage, first raise VDD1(9V) and then VDD2 (5V). To lower voltage, first lower VDD2 (5V) and then VDD1 (9V). Mode Description Mode Description RS Internal Externel S/H Yes No No Pin condition 4 pin SHSW 19 pin RSSW 21 pin EXRS GND VDD2 VDD2 GND GND VDD2 VDD2 VDD2 RS Input Capacity of Pins Item Input capacity of CLK pin Input capacity of ROG pin Input capacity of EXRS pin Symbol CCLK CROG CEXRS Min. -- -- -- Typ. 10 10 10 Max. -- -- -- Unit pF pF pF Recommended Input Pulse Voltage Parameter Input clock high level Input clock low level Min. 4.5 0.0 Typ. 5.0 -- Max. 5.5 0.5 Unit V V -4- ILX503A Electro-optical Characteristics (Ta = 25C, VDD1 = 9V, VDD2 = 5V, Clock frequency: 1MHz, Light source = 3200K, IR cut filter: CM-500S (t = 1.0mm)), When Internal RS (Pin 19 = GND, Pin 21 = VDD2) Item Sensitivity 1 Sensitivity 2 Sensitivity 3 Sensitivity 4 Sensitivity nonuniformity Saturation output voltage Dark voltage average Dark signal nonuniformity Image lag Dynamic range Saturation exposure 9V supply current 5V supply current Total transfer efficiency Output impedance Offset level Symbol R1 R2 R3 R4 PRNU VSAT VDRK DSNU IL DR SE IVDD1 IVDD2 TTE ZO VOS Min. 22.5 -- -- -- -- 1.5 -- -- -- 750 0.040 -- -- 92.0 -- -- Typ. 30 95 20 500 2.0 1.8 0.3 0.5 0.02 6000 0.060 8.0 3.0 97.0 600 4.5 Max. 37.5 -- -- -- 8.0 -- 2.0 3.0 -- -- -- 14.0 6.0 -- -- -- Unit V/(lx * s) V/(lx * s) V/(lx * s) V/(lx * s) % V mV mV % -- lx * s mA mA % V Remarks Note 1 Note 2 Note 3 Note 4 Note 5 -- Note 6 Note 6 Note 7 Note 8 Note 9 -- -- -- -- Note 10 Notes) 1) For the sensitivity test light is applied with a uniform intensity of illumination. 2) W lamp (2854K) 3) Light source: LED = 570nm 4) Light source: LED = 660nm 5) PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 1. PRNU = (VMAX - VMIN)/2 x 100 [%] VAVE The maximum output is set to VMAX, the minimum output to VMIN and the average output to VAVE. 6) Integration time is 10ms. 7) VOUT = 500mV 8) DR = VSAT/VDRK When optical accumulated time is shorter, the dynamic range gets wider because dark voltage is in propagation to optical accumulated time. 9) SE = VSAT/R1 10) VOS is defined as indicated below. D31 OS D32 D33 S1 VOS -5- GND Clock Timing Diagram (For internal RS mode) 5 ROG 0 2 3 4 2087 1 5 CLK 0 D1 1 VOUT D2 D3 D4 D5 D6 Dummy signal (33 pixels) D11 D12 D13 D14 D15 Optical black (18 pixels) D31 D32 D33 S1 S2 S3 S4 Effective picture elements signal (2048 pixels) 1-line output period (2087 pixels) S2045 S2046 S2047 S2048 D34 D35 D36 D37 D38 D39 Dummy signal (6 pixels) Internal S/H is not in use (Pin 4 VDD2) ILX503A 2 -6- Clock Timing Diagram (For external RS mode) 5 ROG 0 2 3 4 2087 1 5 CLK 0 5 RS 0 1 VOUT D2 D3 D4 D5 D6 Dummy signal (33 pixels) D11 D12 D13 D14 D15 Optical black (18 pixels) D31 D32 D33 S1 S2 S3 S4 Effective picture elements signal (2048 pixels) 1-line output period (2087 pixels) S2045 S2046 S2047 S2048 D34 D35 D36 D37 D38 D39 Dummy signal (6 pixels) 2 -7- ILX503A ILX503A CLK, VOUT Timing (For internal RS mode) t1 t2 CLK t3 t4 t10 VOUT t17 Item CLK pulse rise/fall time CLK pulse duty1 CLK - VOUT 1 CLK - VOUT 2 1 100 x t3/(t3 + t4) Symbol t1, t2 -- t10 t17 Min. 0 40 50 30 Typ. 10 50 80 75 Max. -- 60 110 120 Unit ns % ns ns -8- ILX503A CLK, RS, VOUT Timing (For external RS mode) t1 t2 CLK t3 t5 t4 RS t8 t6 t11 t9 t7 t10 VOUT t18 Item CLK, RS pulse rise/fall time CLK pulse duty1 CLK - RS pulse timing CLK - RS pulse timing RS pulse period CLK - VOUT RS - VOUT 1 100 x t3/(t3 + t4) Symbol t1, t2, t8, t9 -- t6 t7 t5 t10 t11, t18 Min. -- 40 0 50 50 50 30 Typ. 10 50 100 100 100 80 50 Max. 50 60 -- -- -- 110 70 Unit ns % ns ns ns ns ns -9- ILX503A ROG, CLK Timing ROG t13 t14 t15 CLK t12 t16 Item ROG, CLK pulse timing ROG pulse rise/fall time ROG pulse period Symbol t12, t16 t13, t15 t14 Min. 500 0 500 Typ. 1000 10 1000 Max. -- -- -- Unit ns ns ns - 10 - ILX503A Example of Representative Characteristics Spectral sensitivity characteristics (Standard characteristics) 1.0 Ta = 25C 0.9 0.8 Relative sensitivity 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 400 500 600 700 800 Wavelength [nm] 900 1000 MTF of main scanning direction (Standard characteristics) 0 1.0 Spatial frequency [cycles/mm] 7.1 14.3 21.4 28.6 35.7 1.0 0 MTF of sub scanning direction (Standard characteristics) Spatial frequency [cycles/mm] 7.1 14.3 21.4 28.6 35.7 0.8 0.8 X-MTF 0.4 Y-MTF 0 0.6 0.6 0.4 0.2 0.2 0 0.2 0.4 0.6 0.8 Normalized spatial frequency 1.0 0 0 0.2 0.4 0.6 0.8 Normalized spatial frequency 1.0 - 11 - ILX503A Dark signal voltage rate vs. Ambient temperature (Standard characteristics) VDD1, VDD2 supply current vs. Clock frequency (Standard characteristics) IVDD1 IVDD2 10 10 5 5 1 IVDD1, IVDD2 - VDD1, VDD2 supply current [mA] 0 10 20 30 40 50 Ta - Ambient temperature [C] Dark signal voltage rate 1 0.5 0.5 0.1 0.1 0.1M 1M Clock frequency [Hz] 5M - 12 - Application Circuit (When internal RS) 10/16V 1 5V 9V 22 VDD2 (D) EXRS VDD1 (A) RSSW VGG GND (A) GND (A) VDD1 (A) NC NC GND (D) 21 20 19 18 17 16 15 14 13 12 22 pin DIP - 13 - VOUT 1 5 (D) GND 2 SHSW 4 CLK (A) GND 3 (A) VDD1 6 (D) GND 7 (D) VDD2 8 T1 9 CLK 2SA1175 NC 10 ROG 11 0.01 10/16V 0.01 ROG 22/10V 3k Output signal ILX503A Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. ILX503A Notes on Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) Regulation for raising and lowering the power supply voltage When raising the supply voltage, first raise VDD1 (9V) and then VDD2 (5V). Similarly, lower VDD2 (5V) first and then VDD1 (9V). 3) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering tool, ground the controller. For the control system, use a zero cross type. 4) Dust and dirt protection a) Operate in clean environments. b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks. - 14 - Package Outline Unit: mm 22pin DIP (400mil) 22 12 5.0 0.5 1 40.2 11 4.0 0.5 2.54 0.51 2.6 3.3 0.5 - 15 - 0.3 M 1. The height from the bottom to the sensor surface is 1.61 0.3mm. 2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5 . PACKAGE STRUCTURE PACKAGE MATERIAL Cer-DIP LEAD TREATMENT TIN PLATING LEAD MATERIAL 42 ALLOY PACKAGE WEIGHT 3.9g (AT STAND OFF) 10.16 H 0.25 V No.1 Pixel 9.0 10.0 0.5 0 to 9 7.35 0.8 41.6 0.5 28.672 (14m x 2048Pixels) ILX503A |
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